Electronica 2026
Messe München
November 10-13, 2026
Munich, Germany
Booth C2-654
We will be exhibiting at electronica 2026, taking place from November 10–13 in Munich, Germany. We look forward to meeting you at Booth C2-654.
Explore MacDermid Alpha Electronics Solutions' portfolio of advanced materials for power electronics, engineered to enable high performance, thermal efficiency, and long-term reliability in demanding applications such as automotive electrification, renewable infrastructure, and data center power systems.
Reliability for the Electronics Systems That Move Power, Data, and Mobility
Electronics are carrying more power through smaller systems. The journey from design target to field reliability depends on materials that can keep heat, current, and mechanical stress under control. Our focus at electronica 2026 is reliability for the electronics systems that move power, data, and mobility.
We help makers turn thermal design intent into a dependable attach strategy for high-performance power modules. Our Argomax power electronics materials improve thermal paths, bond reliability, and line confidence in demanding applications across mobility, industrial power, energy infrastructure, and data-driven electronics. Trusted by leading power module manufacturers worldwide, our materials are proven in high-volume production environments.
You face higher power density, tighter thermal limits, and more pressure to keep high-volume assembly stable. We connect material choice to practical outcomes: reliability, process control, cost risk, and application support.
Solutions on Display at electronica 2026
- Power Electronics: ALPHA® Argomax® sintering materials improve thermal paths, bond reliability, and line confidence in demanding power modules.
- AI & High-Performance Computing: ALPHA® TrueHeight® solder preforms deliver precise, controlled attach for consistent bond lines and reliable performance in high-volume assembly.
- Electrified Mobility: Power electronics attach and thermal management materials that keep heat, current, and mechanical stress under control from design target to field reliability.
The customer sees a power module. We see a thermal path, a bond line, and a thousand chances for variation. Let's discuss yours.
Bring your current application challenge with you. We will review your package requirements, reliability targets, and process constraints, and help you identify where your process is performing well, where qualification risks may exist, and which material approaches could support your next development or test plan.
Meet the MacDermid Alpha technical team at booth C2-654. We look forward to welcoming you.
Event Registration Link for ticket purchase: Messe München - electronica