EPTC 2025
Resorts World Sentosa
Booth #22
December 2 - 5, 2025
Singapore
Join us at ETPC 2025, held at Resorts World Sentosa, Singapore, from 2–5 December 2025. Visit us at Booth #22 to explore our latest innovations in electronics, semiconductor, and circuit board technologies.
Explore our latest innovations in die-attach adhesives, thermal interface materials, and substrate finishes. Learn how we’re helping drive reliability, sustainability, and yield in next-generation devices from AI/HPC to automotive, telecom, and industrial applications.
EPTC 2025 - Exhibitor & Technical Presentations
Join our technical experts as they share insights into next-generation packaging and assembly technologies at EPTC 2025, held at Resorts World Sentosa Convention Centre, Level 1, Singapore, from December 2nd to 5th.
Poster Presentation – Interactive Presentation 1
Topic: Fine Powder Solder Paste with Novel Water Soluble Chemistry – An Enabler for Next Generation System-in-Package Assembly
Speaker: Saurabh Shrivastava, Principal R&D Scientist
Session: Materials and Processing | Interactive Presentation 1 (Poster) | LEO 1 - 4
Date/Time: December 3rd | Presented within the 3:10 PM - 4:40 PM session
Dedicated Exhibitor Session
Topic: Grain Growth Fine Grain Cu – Hybrid Bonding Solution
Speaker: Yilhak Lee, Director, Commercial WLP APAC
Session: Exhibitor Session | Virgo 1-4
Date/Time: December 4th | 16:05 - 16:10
Don’t miss this opportunity to connect with our team and discover how we’re advancing materials innovation in Wafer-Level Packaging and Advanced Packaging.