IEMT Asia 2026

Join MacDermid Alpha Electronics Solutions at IEMT 2026 in Putrajaya, Malaysia, October 14–16, where our experts will explore how integrated materials innovations are helping address the growing demands of AI, high-performance computing, power electronics, and data center infrastructure. 

Clare Wang, Business Development Director, will deliver the opening presentation on October 15th focused on how increasing integration, power density, and package complexity are creating new challenges across thermal management, warpage, interconnect reliability, and high-reliability manufacturing: 

• Date: Thursday, 15 October 
• Session: C1 - Material Development 
• Time: 12:05 - 12:25 Singapore Standard Time (SST) 
• Presentation: C1.5: Advancing the AI Era Through Integrated Packaging and Assembly Innovations 

Her presentation will highlight integrated innovations for AI data centers across our portfolio, including fluxes, solder pastes, edge-bond materials, lid-attach solutions, thermal interference material, metal spacer and ARGOMAX® sintering technologies, ATROX® die-attach materials, potting materials, and getters. 

The program will also feature a poster presentation on October 16th from Syahirul Ali, Business Development Manager, focused specifically on ATROX® CD 560 copper-filled conductive die attach technology and its role as an alternative material platform for applicable semiconductor packaging applications: 

• Date: Friday, 16 October 
• Session: Poster Session 4 
• Time: 15:00 - 15:30 
• Presentation: P4:1 128: Advanced Copper Based Die Attach: A High Performance Alternative to Silver Filled Systems 

As AI accelerates the adoption of chiplets, 2.5D/3D packaging, HBM, and wide-bandgap power devices, materials innovation will play an increasingly important role in enabling the next generation of reliable, high-performance electronics. 

We look forward to connecting with customers and industry colleagues at IEMT 2026.