IMAPS Symposium 2026

Join MacDermid Alpha at IMAPS Symposium 2026, September 28–October 1 at Encore Boston Harbor, to discover material solutions for reliable microelectronics and sensor packaging. 

Explore our STAYDRY® getter and STAYSTIK® adhesive technologies, including STAYDRY® HiCap3000 PSA, a high-capacity moisture and CO₂ getter featuring pre-applied adhesive, room-temperature attachment and no activation requirement. 

Exhibition: September 29–30 | Encore Boston Harbor, Massachusetts  

Featured Presentations 

 

Pioneering Bottom-Up Copper Plating: Advanced Pillar-Like Metallization for High Aspect Ratio Through Glass Vias 

Sean Fleuriel, R&D Chemist, will discuss the challenges of filling increasingly high-aspect-ratio through-holes in thick IC substrate cores for high-performance computing (HPC) and artificial intelligence (AI) applications. He will introduce a developing bottom-up fill (BUF) approach using direct-current (DC) electrolytic copper deposition, offering greater flexibility across different hole geometries and aspect ratios while eliminating complex PPR waveform engineering, primary metallization and conventional seed layers. The presentation will explore the technology’s ongoing development, key challenges and potential solutions, as well as the benefits of this approach for advanced IC substrate fabrication. 

Date: September 29, 13:00~13:25 

Location: Picasso 1 

Enabling High-Density Power Packaging: Bridge and Fill for Through-Hole Filling in Advanced IC Substrate Core 

Inosh Perera, R&D Chemist, will evaluate through-hole (TH) filling as a critical technology for managing the electrical and thermal demands of high-power HPC, AI and data center packages. He will present an optimized bridge-and-fill process that enables defect-free filling of challenging, high-aspect-ratio THs while controlling surface dimples and copper thickness. The study also examines process optimization and hybrid TH geometries, demonstrating a scalable approach that supports reliable power delivery, thermal management and manufacturing requirements for next-generation high-performance packaging. 

Date: September 29, 16:00~16:25 

Location: Picasso 1 

Visit the MacDermid Alpha team at IMAPS Symposium 2026 to learn how our getter and adhesive technologies are helping build greater reliability into the next generation of microelectronics.