Productronica Europe 2025

We are excited to present a comprehensive portfolio of integrated solutions tailored to the evolving demands of circuit board assembly. Designed for reliable performance, our technologies help manufacturers reduce defects, enhance product lifespan, and streamline production processes. 

Visit us at Booth A4-349 and learn more about our featured solutions, including: 

ALPHA® OM-100 SnCX® 07: A lead-free, silver-free, no-clean solder paste that delivers SAC-comparable reliability at a lower total cost. With 50% greater mechanical strain resistance than SAC305, it enhances durability in white goods and smart home electronics while maximizing value without compromising performance. 

Electrolube® LGF200 and LGF400: Liquid Gap Fillers deliver reliable, long-term performance by conforming to complex geometries, staying in place, and maintaining stability over time across a wide operating temperature range from -50°C to +200°C. Offering up to 4 W/m-K thermal conductivity and an easy 1:1 mix ratio, this solution simplifies application and increases production throughput. 

ALPHA® HiTech® CF31-4026: An advanced reworkable edgebond that strengthens BGA components in automotive, high-performance computing, and other high-temperature applications, ensuring durability and reworkability for uncompromised reliability. 

We invite you to visit Booth A4-349 to explore our latest developments and discuss how they address today’s assembly challenges while enabling tomorrow’s electronics.