Productronica India 2026
Bangalore International Exhibition Centre (BIEC)
September 16-18, 2026
Bengaluru, India
Booth H4.G35
Join MacDermid Alpha Electronics Solutions at Productronica India 2026 to see advanced materials supporting long-term reliability and manufacturing efficiency.
As power density, miniaturization, and production demands increase, manufacturers are balancing more complex thermal and assembly requirements. Connect with our team to discuss materials and technologies designed to support these priorities across electronics assembly, board-level protection, and thermal management.
Materials for Breakthrough Performance
Electrolube® UVFlex Conformal Coating
Combines fast UV cure with high elasticity to help maintain coating integrity through thermal cycling and environmental stress, with high SIR supporting greater electrical reliability.
Provides SAC-comparable reliability in a silver-free solder paste, with up to 50% greater mechanical strain resistance.
Solder paste supports reliable ultra-fine-feature printing in high-density SMT assembly, including component sizes down to 008004.
No-clean flux combines broad process capability, thermal stability, and reliable hole filling for wave and selective soldering processes.
The expanded range offers thermal conductivities from 1.5 to 24 W/m·K, with soft, reinforced, and custom-thickness options to match application requirements.
Building Breakthroughs
We look forward to welcoming you at Booth H4.G35 to connect with our team and discuss your application requirements.