TPCA Show and IMPACT Conference 2025
TaiNEX Hall 1 Taipei, Taiwan
Booth #L213
October 21 - 24, 2025
Address: No.1, Jingmao 2nd Rd., Nangang District, Taipei City 11568, Taiwan
Discover interconnect solutions for advanced, next-generation applications at TPCA 2025. Join us at booth #L213 to discover our latest, high-performance PCB materials that are empowering cutting-edge designs for high-performance computing, AI, and complex IC substrates. Uncover the latest insights in PCB and IC substrate fabrication as our experts present four technical papers at the IMPACT Conference on topics including direct metallization, advanced IC substrates, panel-level packaging and sustainable final finishes.
Explore our high-performance solutions for advanced interconnects:
PC 610: Industry-leading pulse plating process designed to provide excellent throwing power within through-holes, surface copper thickness, and surface copper variation.
Shadow® Plus: Our most advanced graphite-based direct metallization technology, Shadow Plus, is designed to meet the industry’s need for increased functionality and complex board designs, while delivering substantial sustainability benefits over traditional electroless copper primary metallization.
Systek™ IC Substrate Solutions: From trace plating to blind via and through-hole filling, our Systek acid copper electroplating technology delivers flexible, reliable results for complex fine-line and through-hole designs, maximizing IC substrate performance.
Affinity™ ENIG/ENEPIG: Portfolio of surface finishes that stand out for delivering best-in-class thickness uniformity and eliminating corrosion. These systems offer exceptional durability and solderability, making them ideal for mission-critical applications that demand long-term reliability.
Join our technical experts as they share valuable insights into next-generation technologies at the IMPACT Conference and Tech x Total Solution Forum:
IMPACT Conference
Direct Metallization Technology Advancements
Speaker: Carmichael Gugliotti, Product Manager for Primary Metallization
Session: Metallization & Advanced Substrate Process Integration | 502, TaiNEX 1
Date/Time: October 21st | 17:30-17:45
Speaker: Saminda Dharmarathna, R&D Line of Business Partner – IC Substrates
Session: Process & Manufacturing in Advanced packaging | 504c, TaiNEX 1
Date/Time: October 22nd | 15:30-16:00
Convergence – Overcoming Plating Challenges: WLP to PLP
Speaker: Steven Tam, Product Director - IC Substrates
Session: LAM RESEARCH Session | 502, TaiNEX 1
Date/Time: October 23rd | 10:40-11:10
Can ENIG / ENEPIG Processes be More Sustainable?
Speaker: Frank Xu, Global Product Director – Final Finishes
Session: Advanced Materials & Processing for Electronic Packaging | 502, TaiNEX 1
Date/Time: October 23rd | 13:15-13:30
Tech X Total Solutions
Enabling AI and HPC: Defect-Free, Co-Planar Copper Via Fill and Through Hole Plating Process for Advanced IC Substrates
Speaker: Steven Tam, Product Director – IC Substrates
Session: Pack Vision session | Room B (K1407)
Date/Time: October 22nd | 14:00-14:40
Solutions for the Metallization Challenges of Vias in Advanced Materials
Speaker: Albert Tseng, Product Manager
Session: Hyper Edge session | Room A (N1131),TaiNEX 1
Date/Time: October 23rd | 14:00-14:40
Don’t miss this opportunity to connect with our team and discover how we’re shaping the future of electronics!
Register here: https://www.tpcashow.com/en/