Making Holes Conductive Webinar

As PCB technologies continue to increase in complexity and demand grows across automotive, communications, consumer electronics and high-performance computing applications, manufacturers face greater challenges in delivering reliable, high-quality interconnects. Primary metallization, the process of making PCB holes conductive, is a critical foundation of PCB fabrication, directly influencing downstream processing and reliability of the finished board.  

This webinar will provide practical insights into the two primary metallization approaches to creating conductive pathways through PCB holes: electroless copper and direct metallization. Attendees will gain a clear understanding of the strengths and limitations of each technology and the impact choosing the correct process has on performance, reliability, yield, and subsequent manufacturing processes.  

When: September 29^th at 4:00 PM India Standard Time 

What You’ll Learn: 

• Explore the advantages, limitations and key differences between electroless copper and direct metallization  
• Discover how primary metallization choices can affect subsequent manufacturing processes and overall board quality  
• Understand the key factors to consider when selecting a primary metallization process for your application  
• How process selection can help address manufacturing yield, performance and long-term reliability challenges in PCB fabrication  

Reserve Your Spot Today! 

Don’t miss out on this opportunity to learn about how selecting the correct primary metallization can address performance, reliability, process efficiency and yield challenges for today’s advanced interconnect applications.  

Register Here