Structural Adhesive

Structural adhesive for additional bonding of components to flexible and formable circuit tracks.

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产品概述

XtraForm A9000 is a structural adhesive designed for use with polyethylene terephthalate (PET) and polycarbonate (PC) films to attach active and passive components for in-mold electronics (IME), as well as other integrated electronics and smart structures. It functions through capillary action by being applied directly between the pre-printed pads for the attachment and reinforcement of surface mount device (SMD) components, including LEDs and resistors. XtraForm A9000 is compatible with XtraForm Electrically Conductive Adhesive (ECA), formable silver, and dielectric inks, enabling the fabrication of complex multilayer structures that can be thermoformed and overmolded.

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