XtraForm® Dielectric Ink
Formable dielectric inks for printing insulating areas between formable circuit tracks.
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These UV-curable inks provide unparalleled performance benefits, including low pinhole defects, improved first-pass yield, and strong adhesion to our silver inks, carbon inks, and adhesives. This inter-compatible suite of materials supports robust, reliable device performance across a wide range of applications.
Ideal for use as crossover and barrier dielectrics or for component encapsulation, these inks serve diverse end markets such as automotive, consumer electronics, medical devices, aerospace, smart packaging, and the Internet of Things (IoT).
Key features include outstanding fine-line printing, excellent abrasion resistance, and a broad process window. These highly insulating dielectric inks are also compatible with a range of polymer substrates, including PET, polyimide (PI), and other films commonly used in printed electronics.