ATROX® CD 590-HT2
Thermosetting conductive die attach for substrate and metal lead frame packages
联系我们产品概述
ATROX CD 590-HT2 is a thermosetting electrically conductive die attach designed for substrate based as well as metal lead frame semiconductor packages. This solution combines high thermal conductivity with excellent electrical performance to provide a high reliability die attach solution with broad die size and multipackage capability.
Product Features
High Thermal Conductivity
At 10 W/mK bulk thermal conductivity, CD 590-HT2 offers a high-performance solution to meet requirements of higher functionality legacy packages like Quad Flat No-Lead package (QFN), Quad Flat Package (QFP)
Robust Process Stability
Broad process window with long open time and staging time to provide a production ready material
Regulatory Compliance
Zero Per- and Polyfluoroalkyl Substances (PFAS) die attach to meet industry’s demand for PFAS-free solutions to replace existing products with PFAS
Proven Reliability
Engineered for stability in Moisture Sensitivity Level (MSL) and thermal cycling tests, ensuring consistent electrical and thermal performance across operating conditions.
Broad Package Compatibility
Supports die attach for both metallized and bare silicon dies without die size limitation, providing flexibility across multiple semiconductor package types.
Optimized Cure Profile
Cures with a controlled ramp-soak profile at 125–175 °C, with options up to 200 °C for enhanced adhesion, minimizing thermal stress while allowing process flexibility.
Comprehensive Die Attach Solution for Broad Package Types
ATROX CD 590-HT2 is an electrically conductive, thermosetting die attach formulated for both substrate-based and metal lead frame semiconductor packages. Delivering strong thermal conductivity alongside excellent electrical properties, it offers a reliable solution that supports a wide range of die sizes and package types.
High-Conductivity, PFAS-Free Reliability for Legacy Packages
With 10 W/mK thermal conductivity and a broad processing window, ATROX CD 590-HT2 is engineered for reliable attach in legacy packages such as QFN and QFP. Its PFAS-free formulation supports industry demand for sustainable, next-generation replacements to older PFAS-containing materials.
Featured Applications
Power Module Assembly
Ideal for attaching dies in power modules, including both metallized and bare silicon, where high thermal conductivity and long-term reliability are essential.
Automotive & EV Electronics
Supports critical attach requirements in underhood and electric vehicle systems such as traction inverters, DC/DC converters, and onboard chargers.
Industrial & High-Reliability Systems
Well-suited for ruggedized industrial controls, aerospace, and medical electronics that demand stable performance under thermal cycling and extended operating conditions.