KPCA Show 2026
Songdo Convensia Convention Center
Booth D401
September 9-11, 2026
123 Central-ro, Yeonsu-gu, Incheon, South Korea
Explore our high-performance Printed Circuit Board (PCB) and IC substrate solutions at the KPCA Show 2026. Visit our technical experts at booth #D401 to discover how our advanced specialty chemistries enable higher circuit densities, finer geometries and enhanced functionality, supporting the increasing complexity of today’s thinner, faster electronic devices.
MacDermid Alpha is excited to announce our participation at the KPCA Show 2026, officially known as the International Electronic Circuits and Packaging Show, Korea’s leading trade exhibition for the PCB and semiconductor packaging industries.
Meet our experts to explore how our solutions support next-generation applications, including high-performance computing (HPC) and artificial intelligence (AI), where performance, scalability, and reliability are critical. As a trusted materials partner, we are driving innovation in high-reliability circuit fabrication through advanced direct metallization, electrolytic plating, and interconnect technologies.
Discover our cutting-edge interconnect solutions for advanced applications:
- Periodic Pulse Reverse (PPR) Plating Chemistries – Next-generation pulse plating technologies engineered to deliver superior throwing power, enhanced thickness uniformity, and high production speeds for ultra-high-layer count and advanced high-density interconnect (HDI) designs.
- MacuSpec™ Via Fill Technologies – Proven copper via filling solutions, including MacuSpec™ VF-TH 500 and AVF 700, that deliver exceptional filling performance, process stability, and reliability across complex HDI architectures.
- Systek™ IC Substrate Solutions – Advanced acid copper electroplating processes supporting trace plating, blind via, and through-hole filling, enabling precise, reliable fabrication of fine-line IC substrate designs.
- Affinity™ Flex – A next-generation Electroless Nickel Immersion Gold (ENIG) finish designed for flexible circuits, providing stress mitigation, enhanced durability, and improved long-term reliability.
Connect with our team at the KPCA Show 2026 to learn how we are building breakthroughs that are empowering the next generation of PCB and IC substrate innovation.