Semicon India 2026

Explore Silver-Alternative Die Attach 

ALPHA® ATROX® CD 560-1 is an alternate-silver filler conductive die attach paste designed for standard die attach applications in metal leadframe semiconductor packages. Manufactured with no added PFAS, it supports high-throughput automated dispensing, strong adhesion to copper and pre-plated leadframes, and low-outgassing performance. 

For applications where silver price volatility is an important consideration, ATROX CD 560-1 provides manufacturers with an additional material option while supporting the process and reliability requirements of semiconductor assembly. 

Explore ALPHA® ATROX® die attach solutions: ATROX® CD 560-1 | MacDermid Alpha 

As semiconductor power densities increase, die attach materials must efficiently move heat while maintaining reliable adhesion and manufacturing consistency. 

ATROX® 800HT2VX is a PFAS-free hybrid silver-sintered die attach paste that delivers approximately 175 W/m·K bulk thermal conductivity for high-power semiconductor packages with metallized dies. Its pressureless process, low resin bleed-out and low condensable organics support reliable die attach while remaining compatible with high-throughput automated dispensing. 

Explore high-thermal die attach solutions: ATROX® 800HT2VX | MacDermid Alpha 

From Evaluation to Qualification 

Our application specialists can work with engineering teams to discuss package-specific requirements, material evaluation and qualification considerations, including dispense behavior, bondline consistency, void control and adhesion. 

Meet our technical experts at Booth H6807 to discuss your application and qualification requirements. 

Connect with our experts: Contact us | MacDermid Alpha 

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