Semicon Taiwan 2026
Taipei Nangang Exhibition Center
September 2 – 4, 2026
TaiNEX 1&2, No.1, Jingmao Rd, Nangang District, Taipei, Taiwan
Discover our leading-edge interconnect solutions that drive innovation in next-generation semiconductor designs at SEMICON Taiwan 2026. Visit our experts at booth #L0800 to learn how our complete portfolio of integrated solutions from wafer fabrication and IC substrate technologies to die attach and adhesive solutions deliver the performance, precision, and reliability required for today’s complex semiconductor architectures.
Join our experts at SEMICON Taiwan to learn how our integrated materials portfolio is driving innovation across the semiconductor value chain. As device architectures evolve to support increasingly powerful CPUs, GPUs, and AI accelerators, interconnect technologies must meet unprecedented demands for uniformity, efficiency, and performance capability. Our materials and process solutions are designed to address these challenges, enhancing electrical and thermal performance, enabling high first-pass yields, and ensuring long-term reliability for the most advanced applications.
Discover Leading-Edge Advanced Interconnect Solutions:
Our range of advanced semiconductor and interconnect solutions including metallization chemistries for high-density, high-performance designs, precision circuity for IC substrates, and robust solutions for wafer and panel-level packaging, are designed to empower next-generation innovations from high-performance computing to leading-edge AI architectures:
- Low Alpha Tin Materials - Our Low Alpha Tin portfolio offers the ultimate solution for eliminating alpha particle emissions in critical semiconductor applications. With a vertically integrated supply chain, we ensure high purity and sustainable sourcing.
- MICROFAB® EVF NiBAR - Advanced boric acid–free barrier plating technology that produces a pure, ductile, fine-grained, low-stress nickel deposit. Designed to meet the exacting performance requirements of wafer plating while complying with evolving EH&S regulations.
- ViaForm® - Dual-damascene solutions that meet the precise demands of advanced-node manufacturing, delivering high-performance, void-free fills for complex interconnects.
- Panel Level Packaging Solutions - From copper pillar plating to etching processes, our comprehensive portfolio enables enhanced uniformity, coplanarity and reliability for today’s advanced packaging applications.
Sustainable Die Attach Solutions for Advanced Semiconductor Manufacturing
Elevated silver costs and supply volatility are reshaping material selection in semiconductor assembly. MacDermid Alpha's PFAS-free, die attach ATROX portfolio is engineered to deliver strong PFAS-free package adhesion and sustained reliability while reducing reliance on silver, lowering cost exposure without compromising throughput or package integrity.
- ALPHA® ATROX® CD 560-1 — A silver-alternative die attach solution that helps semiconductor manufacturers address elevated silver costs while supporting throughput, adhesion, and package reliability across high-volume advanced packaging production.
Don’t Miss our Featured Presentation at the TechXPOT Forum
Topic: Electrochemical Materials Driving the Future of Advanced Packaging
Speaker: Yun Hao Hsieh, Ph.D., Global Product Manager
Date: 3rd, September, 14:00 ~14:20
Location: Hall-1 4F TechXPOT Stage
Connect with our team at SEMICON Taiwan 2026 to discover how we are building breakthroughs in advanced packaging to enable the future of semiconductor innovation!
Register here: https://semicontaiwan.org/en