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IMAPS Symposium 2026

Encore Boston Harbor: 1 Broadway, Everett, Massachusetts 02149 
September 29-30, 2026
Boston, Massachusetts

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Webinar - Advantage ATROX®: Unlocking High Performance with Sustainable Die Attach Solutions

Listen to this informative, complimentary, webinar! As the industry shifts towards sustainable, high-performance semiconductor solutions, MacDermid Alpha is leading the way with ATROX®—a PFAS-free die attach material delivering exceptional thermal conductivity, reliability, and environmental compliance.

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FAKUMA 2026, 30th International Trade Fair for Plastics Processing

Messe Friedrichshafen 
October 12-16, 2026 
Friedrichshafen, Germany 
Booth: B5 – 5512 

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The innovative solutions that target impacts of AI in PCB manufacture and assembly

See the innovations reshaping PCB manufacturing for the AI era. Read the full article published by GlobalSpec here.

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MICROFAB® Pure BP

高抗柯肯德尔空洞能力的纯铜工艺,专为铜柱、铜柱凸块和凸块下金属层应用而开发。

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MICROFAB® SC

高速镀铜工艺,用于倒装芯片封装中的铜柱、3D 互连中的铜微凸块以及再布线层。

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MICROFAB® SC-32

酸性镀铜工艺,具有出色的均镀能力,改进整平特性,并能产生延展性好、低应力的镀层。

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MICROFAB® SC-40

高速镀铜工艺,可实现平坦的凸块形状,适用于高速铜柱、铜柱凸块和凸块下金属层。

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MICROFAB® SC-50

高速镀铜工艺,确保精确的凸块高度均匀性和凸块形状控制。

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MICROFAB® SN-300/302

高速、低阿尔法放射纯锡电镀工艺,能产生致密的晶粒结构和均匀的表面形貌。

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