TPCA Show and IMPACT Conference 2026
TaiNEX Hall 1 Taipei
October 19 - 22, 2026
No.1, Jingmao 2nd Rd., Nangang District, Taipei City 11568, Taiwan
Booth L513
Discover advanced interconnect solutions to address the challenges of next-generation PCB fabrication at TPCA 2026. Visit us at booth #L513 to explore materials and process technologies designed to improve reliability, efficiency and manufacturing performance for high-performance computing, AI and complex IC substrate applications. Discover the latest technical insights as our experts present four technical papers at the IMPACT Conference, covering periodic pulse reverse plating, electroless copper, immersion tin surface finishes and bottom-up fill for advanced IC substrates.
As high-performance computing and AI server applications drive increasingly complex circuit board designs, PCB fabricators are facing tighter specifications, higher layer counts, finer features and greater reliability requirements. At TPCA 2026, explore technologies designed to help address these requirements while supporting high first-pass yields, process stability, improved electrical and thermal performance, and long-term reliability.
Explore solutions for your most demanding interconnect requirements:
- Periodic Pulse Reverse (PPR) Plating Chemistries – Next-generation pulse plating technologies engineered to deliver superior throwing power, enhanced thickness uniformity, and high production speeds for ultra-high-layer count and advanced high-density interconnect (HDI) designs.
- MacuSpec™ Via Fill Technologies – Proven copper via filling solutions, including MacuSpec™ VF-TH 500 and AVF 700, that deliver exceptional filling performance, process stability, and reliability across complex HDI architectures.
- Systek™ IC Substrate Solutions – Advanced acid copper electroplating processes supporting trace plating, blind via, and through-hole filling, enabling precise, reliable fabrication of fine-line IC substrate designs.
- Shadow® Plus: Our most advanced graphite-based direct metallization technology, Shadow Plus, is designed to meet the industry’s need for increased functionality and complex board designs, while delivering substantial sustainability benefits over traditional electroless copper primary metallization.
Hear the latest insights at the IMPACT Conference and Tech X Total Solutions Forum:
IMPACT Conference
Enabling Scalable Glass Substrate Manufacturing Through Bottom-Up Fill
Speaker: Steven Tam, Product Director - IC Substrates
Session: LAM Research | 01B, 7F, TaiNEX 2
Date/Time: October 21 | 11:35-11:15
Enhancing Copper Distribution & Surface Uniformity in BGA-Based HDI PCBs via PPR Plating Process
Speaker: Kesheng Feng, Research & Development Director, Metallization
Session: Copper Metallization and Surface Finishing | 703, 7F, TaiNEX 2
Date/Time: October 20th | 13:45-14:00
Impact of Catalyst Chemistry and Line Configuration on Electroless Copper Reliability in Advanced PCB Applications
Speaker: John Carlo, Product Specialist, Primary Metallization
Session: Copper Metallization and Surface Finishing | 703, 7F, TaiNEX 2
Date/Time: October 20th | 14:15-14:30
Recent Progress on Immersion Tin Final Finish
Speaker: Frank Xu, Director, Final Finishes
Session: Copper Metallization and Surface Finishing | 703, 7F, TaiNEX 2
Date/Time: October 20th | 14:30-14:45
Enabling High-Density Power Packaging: Latest advances in Bottom-Up Fill processes for Through-Hole Filling
Speaker: Saminda Dharmarathna, R&D Director - Wafer Level Packaging
Session: Advanced Packaging Process Technologies | 701F, 7F, TaiNEX 2
Date/Time: October 21st | 14:15-14:30
Tech X Total Solutions
The Affinity™ Advantage: ENIG & ENEPIG Solutions
Speakers: Frank Xu, Director, Final Finishes and Yin Kong Choong, Regional Product Manager, Final Finishes
Location: N-1431
Date/Time: October 21st | 11:00-11:40
Enabling Scalable Glass Substrate Manufacturing Through Bottom-Up Fill
Speaker: Simon Wang, Director, IC Substrates
Location: J-1433
Date/Time: October 22nd | 11:00-11:40
Visit booth #L513 at TPCA 2026 to connect with our technical experts, discuss your fabrication challenges and discover proven approaches for advancing PCB and IC substrate manufacturing.
Register here: https://www.tpcashow.com/en/