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ALPHA® TrueHeight® 预成型焊料

带有嵌入式熔合线控制的工程预成型焊料,可防止倾斜、解决翘曲问题并确保焊点厚度一致性。

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ATROX® 558-2C31

ATROX 系列导电型芯片粘合剂旨在满足当今严苛的可靠性要求,为您提供出色的性能。

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ATROX® 850HT1

导电型芯片粘合剂性能优异,可满足当今的高可靠性标准。

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ATROX® 800HT2VX

不含全氟和多氟烷基物质(PFAS)的导电型芯片粘合剂,可提供经济的高性能解决方案,引领先进材料的发展潮流。

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XtraForm® Silver Conductive Ink

Formable silver inks for printing circuit tracks and pads of formable circuits.

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XtraForm® Dielectric Ink

Formable dielectric inks for printing insulating areas between formable circuit tracks.

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Autostat™ Silver Conductive Ink

Flexible silver inks for printing circuit tracks and pads of flexible circuits.

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Autostat™ Dielectric Ink

Flexible dielectric inks for printing insulating areas between flexible circuit tracks.

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Autostat™ Carbon Ink

Flexible carbon inks for additional abrasion resistance over flexible circuit tracks.

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Silver Conductive ECA

Screen printable conductive adhesive for secure connection of components to flexible and formable circuit tracks.

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