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IEMT Asia 2026

Le Méridien Putrajaya
October 14-16, 2026 
Putrajaya, Malaysia 
Booth MBF015 

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TPCA Show and IMPACT Conference 2026

TaiNEX Hall 1 Taipei
October 19 - 22, 2026
No.1, Jingmao 2nd Rd., Nangang District, Taipei City 11568, Taiwan
Booth L513

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FAKUMA 2026, 30th International Trade Fair for Plastics Processing

Messe Friedrichshafen 
October 12-16, 2026 
Friedrichshafen, Germany 
Booth: B5 – 5512 

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Making Holes Conductive Webinar

Join this complimentary webinar on Making Holes Conductive to choose the right primary metallization for PCB reliability.

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IMAPS Symposium 2026

Encore Boston Harbor: 1 Broadway, Everett, Massachusetts 02149 
September 29-30, 2026
Boston, Massachusetts

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Productronica Europe 2025

Trade Fair Center Messe Munchen - Munich, Germany
Booth A4-349 
November 18 - 21, 2025 
Am Messesee 2, 81829 Munich, Germany 

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TPCA Show and IMPACT Conference 2025

TaiNEX Hall 1 Taipei, Taiwan
Booth #L213
October 21 - 24, 2025
Address: No.1, Jingmao 2nd Rd., Nangang District, Taipei City 11568, Taiwan  

 

 

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FED Talks - Sinter Paste Vs. Sinter Film – What Fits For You

Don’t Miss Global Product Manager for Power Electronics, John Hynek, give an online lecture on the comparison of silver sinter paste and silver sinter film for high-reliability die attach. Tune in on November 4th at 10:30 AM CET.

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Kuprion®

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NOVAFAB细晶粒铜电镀工艺荣膺大奖,赋能混合键合应用

麦德美爱法电子解决方案公司(MacDermid Alpha Electronics Solutions)是电子行业集成材料和化学品的领先供应商,我们最新的先进封装解决方案——NOVAFAB细晶粒铜电镀工艺,荣获美国3D InCites协会颁发的“Technology Enablement Award”大奖。

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